Microscopic Structure and Binding Mechanism of the Corrosion-Protective Film of Oleylpropanediamine on Copper in Hot Water

The structure of the film formed by oleylpropanediamine (OLDA) on the copper (Cu) metal surface in water at 150 °C was investigated by combining quantitative NMR and surface characterization methods. We succeeded in quantifying the amount of film formation by precisely determining all mass balances in the systems examined. 2D IR microscopic mapping showed that the film thickness is uneven in the horizontal direction with a length scale of ~100 μm and hundreds of OLDA layers. This film thickness was also confirmed by AFM. The analysis of the C–H stretching vibrational frequency disclosed that the alkyl chains are highly ordered in the layers close to the Cu surface and are conformationally disordered in the layers distant from the Cu surface in the thicker portion of the film. Combining XPS measurements using argon gas cluster ion beam etching with the ICP-AES analysis, we revealed that the key to multiple layering is the formation of a coordination complex of the unprotonated amino groups of OLDA with Cu that presumably results in polymer chain-like network structures. Contact angle measurements at different OLDA concentrations and treatment times showed that the water repellency of the film originated from the thick layering of OLDA molecules with disordered hydrophobic chains.

This document is the Accepted Manuscript version of a Published Work that appeared in final form in The Journal of Physical Chemistry C, copyright © American Chemical Society after peer review and technical editing by the publisher. To access the final edited and published work see https://doi.org/10.1021/acs.jpcc.2c00526.