ID 74519
Title Transcription
ナノ スケール ドウセキソウ マク ノ ネツショリ ニヨル ヒョウメン ケイジョウ ト ナイブ オウリョク ノ ヘンカ キョドウ
Title Alternative
Behavior of Surface Shape and Internal Stress in Nono-scale Copper Multi-layered Film by Heat-treatment
Author
Kusaka, Kazuya Institute of Technology and Science The University of Tokushima Tokushima University Educator and Researcher Directory KAKEN Search Researchers
Hanabusa, Takao Institute of Technology and Science The University of Tokushima Tokushima University Educator and Researcher Directory KAKEN Search Researchers
Kaneko, Kenta Graduate School of Advanced Technology and Science The University of Tokushima
Matsue, Tatsuya Niihama National College of Technology
Sakata, Osami Japan Synchrotron Radiation Research Institute
Keywords
Thermal stress
In-situ measurement
Multi-layered film
Cu thin film
Synchrotron radiation
Sputtering
2θ-sin2ψ diagram
Content Type
Departmental Bulletin Paper
Description
The specimen prepared in this study was multi-layer aluminum nitride and copper films deposited on thermal oxidation silicon by dc sputtering. Thermal stresses in the copper layers were investigated by ultra high X-rays of synchrotron radiation in the heating and cooling process. It found from the sin2Ψ diagrams of the multi-layered film that the copper layers consisted of crystal grains which had two different orientations. One was randomly orientation, and the other was {111} orientation. The FWHM of the diffraction from the {111}-oriented crystal grains was constant regardless of heating temperature. On the other hand, the FWHM of the diffraction from the randomly-oriented crystal grains was decreased with increasing heating temperature at 1st heating cycle and it became constant regardless of heating temperature after 1st heating cycle. The 2θ-sin2θ diagrams of the multi-layered film for the stress measurement showed non-linear. We could obtain thermal stresses in two different orientation crystal grains from the non-linear 2θ-sin2θ diagram at same time. For both crystal grains, the thermal stress differences between the 1st heating and the 1st cooling cycles were shown as a hysteresis loop. In the case of the 2nd thermal cycles, the thermal stresses changed linearly for both crystal grains. For the 1st heating cycle, the compressive thermal stress in the {111}-oriented crystal grains was larger than that in the randomly-oriented one.
Journal Title
徳島大学大学院ソシオテクノサイエンス研究部研究報告
ISSN
21859094
NCID
AA12214889
Volume
54
Start Page
44
End Page
50
Sort Key
44
Published Date
2009
FullText File
language
jpn
departments
Science and Technology