ID | 74519 |
タイトルヨミ | ナノ スケール ドウセキソウ マク ノ ネツショリ ニヨル ヒョウメン ケイジョウ ト ナイブ オウリョク ノ ヘンカ キョドウ
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タイトル別表記 | Behavior of Surface Shape and Internal Stress in Nono-scale Copper Multi-layered Film by Heat-treatment
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著者 |
金子, 健太
徳島大学大学院先端技術科学教育部
松英, 達也
新居浜工業高等専門学校環境材料工学科
坂田, 修身
高輝度光科学研究センター
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キーワード | Thermal stress
In-situ measurement
Multi-layered film
Cu thin film
Synchrotron radiation
Sputtering
2θ-sin2ψ diagram
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資料タイプ |
紀要論文
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抄録 | The specimen prepared in this study was multi-layer aluminum nitride and copper films deposited on thermal oxidation silicon by dc sputtering. Thermal stresses in the copper layers were investigated by ultra high X-rays of synchrotron radiation in the heating and cooling process. It found from the sin2Ψ diagrams of the multi-layered film that the copper layers consisted of crystal grains which had two different orientations. One was randomly orientation, and the other was {111} orientation. The FWHM of the diffraction from the {111}-oriented crystal grains was constant regardless of heating temperature. On the other hand, the FWHM of the diffraction from the randomly-oriented crystal grains was decreased with increasing heating temperature at 1st heating cycle and it became constant regardless of heating temperature after 1st heating cycle. The 2θ-sin2θ diagrams of the multi-layered film for the stress measurement showed non-linear. We could obtain thermal stresses in two different orientation crystal grains from the non-linear 2θ-sin2θ diagram at same time. For both crystal grains, the thermal stress differences between the 1st heating and the 1st cooling cycles were shown as a hysteresis loop. In the case of the 2nd thermal cycles, the thermal stresses changed linearly for both crystal grains. For the 1st heating cycle, the compressive thermal stress in the {111}-oriented crystal grains was larger than that in the randomly-oriented one.
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掲載誌名 |
徳島大学大学院ソシオテクノサイエンス研究部研究報告
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ISSN | 21859094
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cat書誌ID | AA12214889
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巻 | 54
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開始ページ | 44
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終了ページ | 50
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並び順 | 44
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発行日 | 2009
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フルテキストファイル | |
言語 |
jpn
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部局 |
理工学系
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