ID | 118404 |
Author |
Okamoto, Daisuke
Photonics Electronics Technology Research Association
Suzuki, Yasuyuki
Photonics Electronics Technology Research Association
Takemura, Koichi
Photonics Electronics Technology Research Association
Fujikata, Junichi
Photonics Electronics Technology Research Association|Tokushima University
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Nakamura, Takahiro
Photonics Electronics Technology Research Association
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Keywords | Linear amplifier
optical interconnects
optical receivers
optoelectronic integrated circuit
PAM-4
SiGe-BiCMOS
silicon photonics
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Content Type |
Journal Article
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Description | We have developed a silicon photonics receiver integrated with a SiGe-BiCMOS linear transimpedance amplifier (TIA) using the flip-chip bonding technology to assist in resolving the I/O bottleneck problem in inter-chip data communication. The proposed device demonstrated optical 112 Gb/s four-level pulse amplitude modulation (PAM-4) operations and clear eye openings without any equalization for the pseudorandom binary sequence 215 – 1 signal. The 3 dB bandwidth and transimpedance gain were designed to be 37.1 GHz and 60.1 dBΩ, respectively, at a supply voltage of 3.3 V. The consumption current of the linear TIA was 95.1 mA, and it resulted in a power consumption of 314 mW (2.8 pJ/bit). A linear TIA circuit is a key technology for PAM-4 operation; therefore, we discussed the linearity of our receiver response through eye diagrams and simulation. The measured eye diagrams agreed with the simulation results, and the proposed device maintained a linear response for up to 450 μAp-p input current. In addition, its operation rate of 112 Gb/s is the highest operation rate reported for a silicon photonics PAM-4 receiver based on flip-chip 3D integration with a germanium photodetector and a SiGe-BiCMOS linear TIA.
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Journal Title |
IEEE Photonics Technology Letters
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ISSN | 10411135
19410174
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NCID | AA10681067
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Publisher | IEEE
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Volume | 34
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Issue | 3
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Start Page | 189
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End Page | 192
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Published Date | 2022-01-20
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Rights | © 2022 IEEE. Personal use of this material is permitted. Permission from IEEE must be obtained for all other uses, in any current or future media, including reprinting/republishing this material for advertising or promotional purposes, creating new collective works, for resale or redistribution to servers or lists, or reuse of any copyrighted component of this work in other works.
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language |
eng
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TextVersion |
Author
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departments |
Science and Technology
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