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ID 118404
著者
Okamoto, Daisuke Photonics Electronics Technology Research Association
Suzuki, Yasuyuki Photonics Electronics Technology Research Association
Takemura, Koichi Photonics Electronics Technology Research Association
藤方, 潤一 Photonics Electronics Technology Research Association|Tokushima University 徳島大学 教育研究者総覧 KAKEN研究者をさがす
Nakamura, Takahiro Photonics Electronics Technology Research Association
キーワード
Linear amplifier
optical interconnects
optical receivers
optoelectronic integrated circuit
PAM-4
SiGe-BiCMOS
silicon photonics
資料タイプ
学術雑誌論文
抄録
We have developed a silicon photonics receiver integrated with a SiGe-BiCMOS linear transimpedance amplifier (TIA) using the flip-chip bonding technology to assist in resolving the I/O bottleneck problem in inter-chip data communication. The proposed device demonstrated optical 112 Gb/s four-level pulse amplitude modulation (PAM-4) operations and clear eye openings without any equalization for the pseudorandom binary sequence 215 – 1 signal. The 3 dB bandwidth and transimpedance gain were designed to be 37.1 GHz and 60.1 dBΩ, respectively, at a supply voltage of 3.3 V. The consumption current of the linear TIA was 95.1 mA, and it resulted in a power consumption of 314 mW (2.8 pJ/bit). A linear TIA circuit is a key technology for PAM-4 operation; therefore, we discussed the linearity of our receiver response through eye diagrams and simulation. The measured eye diagrams agreed with the simulation results, and the proposed device maintained a linear response for up to 450 μAp-p input current. In addition, its operation rate of 112 Gb/s is the highest operation rate reported for a silicon photonics PAM-4 receiver based on flip-chip 3D integration with a germanium photodetector and a SiGe-BiCMOS linear TIA.
掲載誌名
IEEE Photonics Technology Letters
ISSN
10411135
19410174
cat書誌ID
AA10681067
出版者
IEEE
34
3
開始ページ
189
終了ページ
192
発行日
2022-01-20
権利情報
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フルテキストファイル
言語
eng
著者版フラグ
著者版
部局
理工学系