ID | 118045 |
Title Alternative | The Current Status and Perspective in Testing 3D Stacked ICs
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Author | |
Content Type |
Journal Article
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Journal Title |
Journal of The Japan Institute of Electronics Packaging
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ISSN | 13439677
1884121X
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NCID | AA11231565
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Publisher | エレクトロニクス実装学会
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Volume | 23
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Issue | 1
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Start Page | 32
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End Page | 36
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Published Date | 2020-01-01
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EDB ID | |
DOI (Published Version) | |
URL ( Publisher's Version ) | |
FullText File | |
language |
jpn
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TextVersion |
Publisher
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departments |
Science and Technology
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