| ID | 118045 |
| Title Alternative | The Current Status and Perspective in Testing 3D Stacked ICs
|
| Author | |
| Content Type |
Journal Article
|
| Journal Title |
Journal of The Japan Institute of Electronics Packaging
|
| ISSN | 13439677
1884121X
|
| NCID | AA11231565
|
| Publisher | エレクトロニクス実装学会
|
| Volume | 23
|
| Issue | 1
|
| Start Page | 32
|
| End Page | 36
|
| Published Date | 2020-01-01
|
| EDB ID | |
| DOI (Published Version) | |
| URL ( Publisher's Version ) | |
| FullText File | |
| language |
jpn
|
| TextVersion |
Publisher
|
| departments |
Science and Technology
|
